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4 books found also search"flip chip" in ,
ID Author(s) Title Publisher Year Pages Language Size Extension GET
961939 Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.) Advanced Flip Chip Packaging [1 ed.]
978-1-4419-5767-2, 978-1-4419-5768-9
Springer US 2013 560 English 22 Mb pdf GET
341250 John H. Lau Flip Chip Technologies [1 ed.]
0070366098, 9780070366091
McGraw-Hill Professional 1995 579 English 7 Mb djvu GET
341580 John H. Lau Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies [1 ed.]
0071351418, 9780071351416
McGraw-Hill Professional 2000 602 English 8 Mb djvu GET
906162 Ning-Cheng Lee Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
9780080492247, 008049224X
Newnes 2002 273 English 13 Mb pdf GET

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 Faith Hunter
Greg Bear
Masahiko Fujii, Shinichi Morooka (auth.), Takehiko Saito, Junichi Yamashita, Yoshiaki Oka, Yuki Ishiwatari (eds.)
Raymond E. Feist
Instituto Caribe de Antropologia y Sociologia de la Fundacion La Salle
Lars Hormander
Tracey STRANGE, Anne BAYLEY, OECD Organisation for Economic Co-operation and Development
Joachim Zulch, Luis Barrantes, Sylvia Steinheuser
Jacques Dupont; Nicolas Darrical (tr.)
Karl Marx, Frederick Engels
Gilbert Ryle
Tanja Falkowski
Bruno Palier
Ντόρα Γιαννακοπούλου
Syed A. Ahson, Mohammad Ilyas
John Lawrence Boojamra
Christian Karpfinger, Kurt Meyberg
National Research Council (U. S.)
Arlene Coulson, Noreen Lewis
Matthew Turland
 Cambridge University Press
Cambridge University Press
Cambridge University Press
Morgan & Claypool
Editorial Médica Panamericana

HarperCollins India
Scribner
Harcourt, Brace and Company

University of California Press
HarperCollins Distribution Services
Praeger
Marxistische Blätter
Pluriel
Presses de la fondation nationale des sciences politiques
Editions Romillat
Haag und Herchen
CNRS


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