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5 books found also search"flip chip" in ,
ID Author(s) Title Publisher Year Pages Language Size Extension GET
961939 Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.) Advanced Flip Chip Packaging [1 ed.]
978-1-4419-5767-2, 978-1-4419-5768-9
Springer US 2013 560 English 22 Mb pdf GET
341250 John H. Lau Flip Chip Technologies [1 ed.]
0070366098, 9780070366091
McGraw-Hill Professional 1995 579 English 7 Mb djvu GET
341580 John H. Lau Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies [1 ed.]
0071351418, 9780071351416
McGraw-Hill Professional 2000 602 English 8 Mb djvu GET
906162 Ning-Cheng Lee Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
9780080492247, 008049224X
Newnes 2002 273 English 13 Mb pdf GET
1718907 Sun Yangyang. Study on the nanocomposite underfill for flip-chip application English 4 Mb pdf GET

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