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4 books found also search"flip chip" in ,
ID Author(s) Title Publisher Year Pages Language Size Extension GET
961939 Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.) Advanced Flip Chip Packaging [1 ed.]
978-1-4419-5767-2, 978-1-4419-5768-9
Springer US 2013 560 English 22 Mb pdf GET
341250 John H. Lau Flip Chip Technologies [1 ed.]
0070366098, 9780070366091
McGraw-Hill Professional 1995 579 English 7 Mb djvu GET
341580 John H. Lau Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies [1 ed.]
0071351418, 9780071351416
McGraw-Hill Professional 2000 602 English 8 Mb djvu GET
906162 Ning-Cheng Lee Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
9780080492247, 008049224X
Newnes 2002 273 English 13 Mb pdf GET

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 Sami G. Hajjar
John Imbrie, Norman Newell (editors)
David Chilton
Nora Roberts
Judith Cabaud
Michael Haag
Jane Setter, Cathy Wong, Brian Chan
Alexander Boot
Michael Samways, Peter Hitchins, Orty Bourquin, Jock Henwood
谷春德
Joseph R. McCleary
Frederick Hockley
Alfred C. Roth, Ronald J. Baird
Tcho Mbaimba Caulker
Robin Kaye
V. Smirnov
Heng-Tze Cheng, Feng-Tso Sun, Senaka Buthpitiya, Ying Zhang, Ara V. Nefian (auth.), George Bebis, Richard Boyle, Bahram Parvin, Darko Koracin, Ronald Chung, Riad Hammound, Muhammad Hussain, Tan Kar-Han, Roger Crawfis, Daniel Thalmann, David Kao, Lisa Avila (eds.)
Frédéric Beigbeder
George Kovacs, J. Adam Law
Thierry Magnin



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