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ID Author(s) Title Publisher Year Pages Language Size Extension GET
1291213 Shichun Qu, Yong Liu (auth.) Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications [1 ed.]
978-1-4939-1555-2, 978-1-4939-1556-9
Springer-Verlag New York 2015 322 English 19 Mb pdf GET

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