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2 books found also search"chip scale package" in ,
ID Author(s) Title Publisher Year Pages Language Size Extension GET
340874 John H. Lau, Ricky S.W. Lee, Ricky S. Lee Chip Scale Package: Design, Materials, Process, Reliability, and Applications [1 ed.]
0070383049, 9780070383043
McGraw-Hill Professional 1999 570 English 7 Mb djvu GET
340875 John H. Lau, Ricky S.W. Lee, Ricky S. Lee Chip Scale Package: Design, Materials, Process, Reliability, and Applications [1 ed.]
0070383049, 9780070383043
McGraw-Hill Professional 1999 570 English 8 Mb djvu GET

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